Global HV wafer capacity is expected to grow by about 8% in 2026, with utilization rate dropping to around 70%. Demand is driving rapid technological iteration: Dual Gate, TDDI, TED, RAMless
More>>The BT substrates used in BGA packaging typically adopt a multilayer stacked structure (6-8 layers). By impregnating fiberglass cloth with BT resin, a composite substrate is formed, providing criti
More>>Foreword Under the “red ocean” competition for existing market stock, pricing and channel strategies have become pivotal means to drive short-term shipments. In the global market, Samsun
More>>High-Performance Compact Tablet Market: The 8~9-inch " Dark Horse" Defying Market Trends. Supply Chain Value Reassessed: Panels, Communications, Batteries, and Processing Chips Emerge as Key
More>>Monitor Panel On the supply side, the strategic reduction of monitor LCD capacity by overseas makers, coupled with soft recovery in TV panel demand and growing demand for small-sized applica
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